![]() ![]() This step is followed by the placement of dice on silver area with a Pick&Place automatic machine (Datacon 2200 EVO Plus from Besi), which showed its efficiency in process time and placement accuracy. SN: 950-2218-2386 Wrapped in Storage Room Cell + Diode Attach 400 VAC, 2.3 KVA, 3 PH 6 bar, 20 L/Min 0.8 bar 1.5 Nm3/Hr 1 bar, 1 L/min - 3300 lbs. ![]() csm besi datacon 2200 evo advanced 1000 db160738c9.jpg from besi. In order to get a reliable die attach with sintered silver, a Ti/Au finish is deposited on these die pads. Datacon 2200 APM Bonder - Datacon 2200 evo Bonder - Datacon PPS 2200 Bonder - Datacon 8800FC Quantum Flip Chip Bonder - Delvotec 4200 Die Bonder. The Datacon 2200 evo plus die bonder for Multi Module Attach assembles all kinds of technologies on a tried-and-tested platform, enhanced with key features for higher bonding accuracy and lower cost-of-ownership.īesides unbeaten flexibility and full customization possibilities, this evolutionary machine offers higher accuracy with long-term stability using a new camera system and thermal compensation algorithm, higher speed through a new image processing unit, and improved cleanroom capabilities. datacon 2200evo plus 2016 01.jpg from besiView Photo. Besi Datacon 2200 Evo Plus R2R Pick and Place/Bonding Tool for Hybrid Integration The web-based pick and place/die attach tool provides users with an advanced capability to develop methods for flexible-hybrid electronic circuit integration and system prototyping.
0 Comments
Leave a Reply. |
AuthorWrite something about yourself. No need to be fancy, just an overview. ArchivesCategories |